Electrical overstress, especially due to ESD (Electrostatic Discharge), has become a mounting concern to designers due to increased system densities and speed. These performance gains are due to the giant strides made in integrated circuit complexity and the resulting smaller device sizes.
Internal protection devices built into integrated circuits have been reduced in size to minimize their impact on speed and circuit area.
Protection devices are now repuired at system inputs and outputs to eliminate overstress damage and surface mount technology (SMT) is now placing severe size constraints on components in addition to providing protection.
ESD (Electrostatic Discharge) is a high voltage transient with fast rise time [0.7~1.0ns] and fast decay time [max.60ns]. For protection the circuit or IC from ESD, the protective device should have a fast enough response time to clamp ESD peak, high ESD immunity, repeatibility ESD immunity, low leakage current.
ESD protection capability depends on a kind of devices and ceramic composition in chip varistor. To solve these ESD problems, our company offers highly reliable chip varistor (EV Series)
- Electrical Reliability
: Good Energy Dissipation Capability
: Stable ESD Immunity & Surge Reliability
- IR Reliability
: High Insulation Resistance(IR) Value after Reflow soldering
: Strong Humidity Resistance
- Customized specification
: Varify Capacitance of Small Size (1005size, 3pF~700pF)
: Excellent SMT Compatibility