Item | Heat Resistance | Changing | Marking |
Multilayer Ceramic Capacitor | 1. Heat resistance Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 10±0.5sec 2. Whisker Test: Pass |
- Terminal Plating | RoHS free Label marking ![]() Inner box ![]() Outside box ![]() |
Leaded type MLCC | 1. Heat resistance Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 5±0.5sec |
- Epoxy - Lead Wire |
|
Chip Bead & Inductor | 1. Heat resistance Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 10±0.5sec 2. Whisker Test: Pass |
- Terminal Plating | |
Varistor/NTC (Chip type) | 1. Heat resistance Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 10±0.5sec 2. Whisker Test: Pass |
- Terminal Plating | |
Disc Ceramic Capacitor | 1. Heat resistance Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 5±0.5sec |
- Solder - Paste - Epoxy - Lead Wire |
|
Disc Ceramic Varistor | 1. Heat resistance Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 5±0.5sec |
- Solder - Paste - Epoxy - Lead Wire |
|
EMI Filtetr | 1. Heat resistance Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 5±0.5sec |
- Epoxy - Lead Wire |
|
QMC/AMC/RMES | - Lead Wire | ||