品名 | 信赖度 | 变更 | 表示 |
表面安装型积层陶瓷电容器 | 1. 耐热性 Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 10±0.5sec 2. Whisker Test: Pass |
- 镀金 | 有害物质标签标识![]() 小型箱子 ![]() 大型箱子 ![]() |
READ型积层陶瓷电容器 | 1. 耐热性 Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 5±0.5sec |
- 环氧树脂 - Lead Wire |
|
贴片磁珠(Chip Bead) & 电感器(inductor) | 1. 耐热性 Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 10±0.5sec 2. Whisker Test: Pass |
- 镀金 | |
Varistor/NTC (Chip型) | 1. 耐热性 Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 10±0.5sec 2. Whisker Test: Pass |
- 镀金 | |
盘式陶瓷电容器 | 1. 耐热性 Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 5±0.5sec |
- 焊锡 - 电极 - 环氧树脂 - Lead Wire |
|
盘式陶瓷变阻器 | 1. 耐热性 Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 5±0.5sec |
- 焊锡 - 电极 - 环氧树脂 - Lead Wire |
|
EMI 过滤器 | 1. 耐热性 Recommended reflow soldering Solder Temp.: 260+5/-0℃ Immersion Time: 5±0.5sec |
- 环氧树脂 - Lead Wire |
|
QMC/AMC/RMES | - Lead Wire | ||